TIPC-A/T Building
30 ottobre 2007
C4 Bump & Test Area Project
27 ottobre 2007

Proposed Fab 4X


Wafer Fab in Malta – New York (U.S.A.)

Client: AMD-Advanced Micro Devices
Tipology: Industrial Buildings
Country: US
Year: 2007
Scope of work: Preliminary Design
Notes: Construction start to be defined
Link Progetto: Google Maps